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TE’s AdrenaLINE Catapult near-chip connector is designed for GPU-to-switch and ASIC-to-front panel connectors, utilizing uLGA socket technology. Optimized for 224G high-speed links, the AdrenaLINE Catapult delivers lower latency and higher signal integrity to support improved power efficiency for AI/ML workloads.
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TE’s ELCON Micro wire-to-board connectors deliver compact, high-power solutions for space-constrained server and storage applications. With a low-profile design and robust performance, these connectors enable more efficient power distribution in high-density environments, supporting the scalability and reliability required for next-gen AI and cloud data centers.
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TE’s ICCON high-power pin and socket system delivers robust, scalable connections for demanding power applications in data center and industrial environments. With a compact design and notable current carrying capacity, ICCON interconnects help enable efficient power distribution in space-constrained architectures.
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TE’s LGA4677 socket is designed for next-generation server processors, offering expanded memory channel support and high-speed interconnects to meet the bandwidth demands of AI and data center applications.
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TE’s MULTI-BEAM Pro connector family is designed for advanced Power Supply Units (PSUs) in next-gen AI and cloud data centers. With a low-profile design and enhanced power density, MB Pro helps enable high-performance connections in space-constrained environments. Its modular architecture supports flexible integration, making it a key solution for scaling high-power systems more efficiently.
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TE’s MULTI-BEAM power connectors address the need for higher power and higher performance, supporting higher current per power contact. The modular design allows for high scalability and flexibility in configurations.
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TE’s MULTI-BEAM power connectors address the need for higher power and higher performance, supporting higher current per power contact. The modular design allows for high scalability and flexibility in configurations. 
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TE’s Micro LGA socket features excellent signal integrity performance at high-speed data rates for high-density applications. This innovative solution features contact pins protected within the socket housing to hep prevent pin damage during assembly and disassembly.
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TE’s SideStack mezzanine connectors offer a stackable, high-speed, high-density connection to address the needs of increased bandwidth and higher power density or AI and HPC applications. The scalable and modular design offers maximum flexibility, while supporting superior signal integrity and high current delivery.
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TE’s Sliver internal cabled interconnect system can provide a solution to data rate increase challenges. This flexible and robust solution offers optimal signal integrity for advanced compute and storage devices.
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TE’s Ultra Low-Profile (ULP) PCIe Gen 7 solution is tailored for next-generation GPU sleds, offering ultra-low profile, high-density signal paths and optimized thermal performance. IT supports the demanding compute and bandwidth requirements of modern AI accelerator systems.
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The 48V IT Gear cable assembly from TE is designed for rack-based power architectures, carrying high-current 48V bus power into compute, storage, or switch sleds. These ORv3 IT Gear solutions help enable lower power consumption in power distribution applications.
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The 48V IT Gear cable assembly from TE is designed for rack-based power architectures, carrying high-current 48V bus power into compute, storage, or switch sleds. These ORv3 IT Gear solutions help enable lower power consumption in power distribution applications.
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The AdrenaLINE Catapult cable assembly from TE is engineered for ultra-high-throughput links between GPU modules and system fabrics in next-gen sleds. It enables minimal latency, high-bandwidth signal paths and mechanical robustness in advanced AI compute environments.
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The AdrenaLINE Fastlane cabled I/O connectors are engineered for next-gen AI and data center architectures. Built to support emerging protocols and scalable system configurations, these connectors help enable efficient signal routing and optimized performance for high-density environments.
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The AdrenaLINE Slingshot backplane portfolio delivers high-performance cabled backplane and board mount solutions, designed for the evolving demands of AI-driven architectures. Engineered for next-gen data centers, it combines superior signal integrity with scalable system design to support diverse workloads.
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The AdrenaLINE Slingshot cable assembly from TE is designed for high-density switch sled fabrics, providing ultra-high-speed interconnects between modules. It supports the massive data flows and signal integrity demands of AI-driven communications infrastructure.
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The DDR5 DIMM sockets from TE are engineered for high-performance memory modules in high-performance computing and storage platforms. They enable the high-speed data rates required for AI-driven data workloads, supporting critical memory access in data-intensive architectures.
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The QSFP cage assembly from TE is a high-speed transceiver housing solution designed to support next-generation data center needs, delivering the signal integrity and mechanical robustness required for AI-driven compute architectures.
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